2008年11月5日 星期三

Understanding Fabless IC Technology

This book talks mostly about the bussiness model, than technique of the fabless semiconductor industry.


Fabless Semiconductor Association(FSA)
Integrated Device Manufacturer(IDM)
Electronic Design Automation(EDA)
foundry
Original Equipment Manufacturer(OEM)

Semiconductor Processes
Complimentary Metal Oxide Semiconductor(CMOS)
Specialty/Compound
  • Silicon Germanium (SiGe)
  • Gallium Arsenide (GaAs)
  • Indium Phosphide (InP)
  • BiCMOS
  • Gallium Nitride (GaN)

Semiconductor Manufacturing Steps
  • Wafer Production
  • Wafer Processing
    • Thermal Oxidation
    • Photolithography
    • Etching
    • Doping
  • Dicing
  • Assembly/Packaging
  • Test
Wafer size
The cost factor is the sole reason companies choose to use larger wafers.

Non-Recurring Engineering (NRE)

Design cycle
  • front-end design
    • architectural, system register-transfer-level (RTL) design
    • verification
    • logical synthesis
  • back-end design (physical design)
    • floorplanning
    • placement
    • routing
    • timing closure
    • physical verification

EDA is the bridge between manufacturing and design.

Semiconductor Intellectual Property (SIP)
  • Soft SIP
  • Hard SIP
  • Foundation SIP
  • Memory SIP
  • Connectivity SIP
  • Processor SIP
  • Analog SIP
  • Platform SIP
Verilog, GDSII, SPICE, EDIF, ASCII

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